Printed, Hybrid, Structural & 3D Electronics. | 11 May 2021, 14:00 CEST – 12 May 2021, 22:00 CEST Virtual Event Platform

Schedule

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Tue, 11 May

14:00 - 14:10
10 minutes
TechBlick - Introduction
14:10 - 14:30
20 minutes
IDENTIV - NFC & UHF Flexible & Hybrid Sensor Tags
14:30 - 14:50
20 minutes
Smooth & Sharp - Printed RFID inlay in Mass Production Scale as basis for further FHE product
14:50 - 15:10
20 minutes
CPI - Applications Utilising Roll to Roll Fexible Hybrid Electronics
14:50 - 15:10
20 minutes
Enjet -High-Resolution Printing from 2D to 3D for Additive Manufacturing of Printed Electronics
15:10 - 15:30
20 minutes
XTPL - High-Resolution 3D-Printed Conductive Features In Single Micron Scale
15:10 - 15:30
20 minutes
US Army Research Lab - Hybrid Electronics: Expanding manufacturing options for electronic assembly and packaging
15:30 - 15:50
20 minutes
Networking Break
15:50 - 16:10
20 minutes
CEA - Ultrathin Flexible ICs For Flexible Electronics
16:10 - 16:30
20 minutes
ARM - Towards Natively Flexible ICs
16:10 - 16:30
20 minutes
Coatema - Improvement of yield and performance of OPV by using inline quality control systems & process monitoring”
16:30 - 16:50
20 minutes
SUNEW - OPV Production Scale-Up & Installation Challenge
16:30 - 16:50
20 minutes
American Semiconductor -State-of-the-Art and Issues for Bluetooth® Flexible Hybrid Electronics (FHE)
16:50 - 17:10
20 minutes
Brilliant Matters -New Generation Of Photovoltaic Materials
16:50 - 17:10
20 minutes
Texas Instruments - Semiconductor and Printed Electronics Industries: Overview of emerging applications
17:10 - 17:30
20 minutes
Parsons - Design & Manufacture of Test Coupons for Risk Reduction Studies of Printed Hybrid Electronics Assemblies
17:10 - 17:30
20 minutes
Phillips 66 - Photoactive Polymers Tailored to Industrial Printing of High Performing and Stable Organic Photovoltaics
17:30 - 17:50
20 minutes
Networking Break
17:50 - 18:10
20 minutes
Alpha Assembly -Ultralow Temperature Solder For Flexible Hybrid Electronics
17:50 - 18:10
20 minutes
Ntrium - Recent EMI Shielding Process for Advanced Packaging
18:10 - 18:30
20 minutes
CondAlign - Advantages With Anisotropic Conductive Adhesive Films Comprising Aligned Particles
18:10 - 18:30
20 minutes
ACI Materials - ACI Alchemy Conductive Inks -Enabling Next Generation Flexible & 3D Electronics
18:30 - 18:50
20 minutes
Safi-Tech -Supercooled Fully Metallic FHE Interconnect Technology
18:30 - 18:50
20 minutes
Agfa/Nanogate - Printed Electronics made with Digital Printing: Materials and Application in Motor Sport
18:50 - 19:10
20 minutes
VSParticle - Accelerating the development of new value added materials
18:50 - 19:10
20 minutes
NovaCentrix - PulseForge Soldering – Using flash lamp technology for conventional solder alloy reflow
19:30 - 19:50
20 minutes
C3Nano - Platform Optoelectronic Materials: Flexible, Rollable, Large-Area, Biotech & Beyond
19:30 - 19:50
20 minutes
DuPont Teijin Films/Fraunhofer FEP - Advances in Polyester Film Substrates for Flexible Electronics
19:50 - 20:10
20 minutes
Panasonic - Development of Stretchable, Conformable and Pliable Circuit Materials
19:50 - 20:10
20 minutes
Metamaterial Inc (META) - The Dawn of Electro-Optics: Emerging Multi-functional and High-Performance Metamaterials
20:10 - 20:30
20 minutes
Procter & Gamble/Coca-Cola - Panel Discussion - Smart & Intelligent Packaging

Wed, 12 May

14:00 - 14:10
10 minutes
TechBlick - Welcome & Introdution
14:10 - 14:30
20 minutes
Wuerth - Challenges & Opportunities of AM in Passive Electronic Industry – A Practical Approach on Materials, Designs an
14:30 - 14:50
20 minutes
Signify - Hybrid manufacturing of 3D integrated electronics for LED lighting
14:50 - 15:10
20 minutes
VTT - Roadmap Towards More Environmentally Friendly Electronics
15:10 - 15:30
20 minutes
Prismade - Secure, invisible and green printed electronics. A journey from ID cards to gamification and to blockchain it
15:30 - 15:50
20 minutes
Networking Break
15:50 - 16:10
20 minutes
Kimoto - Application of Flexible Light Diffusion Films in User Interfaces
16:10 - 16:30
20 minutes
PolyIC - Smart HMI surfaces with inmolded touch sensors and decoration
16:30 - 16:50
20 minutes
Kundisch - Applications using Printed and Hybrid Electronics in the HMI Industry
16:50 - 17:10
20 minutes
Sheldahl - The Evolution or Revolution of the Human Machine Interface Market
17:10 - 17:30
20 minutes
e2ip/ Nat Research Council of Canada- Molecular Ink applied to Printed & In-Mold Electronics
17:30 - 17:50
20 minutes
Networking Break
17:50 - 18:10
20 minutes
Danish Technology Institute /ACCIONA - LEE-BED: Services and infrastructure within printed and embedded electronics
18:10 - 18:30
20 minutes
Brewer Science - Printed Smart Devices: Enabling Widespread, Real-Time Sensing
18:30 - 18:50
20 minutes
Applied Materials - Advanced screen printing for PE: two case studies of industrial applications in medical and display
18:50 - 19:10
20 minutes
Hewlett Packard - HP’s 3D Printing of Electronics using Multi Jet Fusion
19:10 - 19:30
20 minutes
IDS - NanoJet: The Next Generation in Aerosol Printing
19:50 - 20:10
20 minutes
NanoOps -High-Throughput Wafer Printing of Nano and Microelectronics: A Fab in A Tool
20:10 - 20:30
20 minutes
Airbus/Boeing - Panel Discussion - Opportunities & Challenges for Printed Hybrid Electronics in Aerospace

Schedule

Tue, 11 May

TechBlick - Introduction

IDENTIV - NFC & UHF Flexible & Hybrid Sensor Tags

Smooth & Sharp - Printed RFID inlay in Mass Production Scale as basis for further FHE product

CPI - Applications Utilising Roll to Roll Fexible Hybrid Electronics

Enjet -High-Resolution Printing from 2D to 3D for Additive Manufacturing of Printed Electronics

XTPL - High-Resolution 3D-Printed Conductive Features In Single Micron Scale

US Army Research Lab - Hybrid Electronics: Expanding manufacturing options for electronic assembly and packaging

Networking Break

CEA - Ultrathin Flexible ICs For Flexible Electronics

ARM - Towards Natively Flexible ICs

Coatema - Improvement of yield and performance of OPV by using inline quality control systems & process monitoring”

SUNEW - OPV Production Scale-Up & Installation Challenge

American Semiconductor -State-of-the-Art and Issues for Bluetooth® Flexible Hybrid Electronics (FHE)

Brilliant Matters -New Generation Of Photovoltaic Materials

Texas Instruments - Semiconductor and Printed Electronics Industries: Overview of emerging applications

Parsons - Design & Manufacture of Test Coupons for Risk Reduction Studies of Printed Hybrid Electronics Assemblies

Phillips 66 - Photoactive Polymers Tailored to Industrial Printing of High Performing and Stable Organic Photovoltaics

Networking Break

Alpha Assembly -Ultralow Temperature Solder For Flexible Hybrid Electronics

Ntrium - Recent EMI Shielding Process for Advanced Packaging

CondAlign - Advantages With Anisotropic Conductive Adhesive Films Comprising Aligned Particles

ACI Materials - ACI Alchemy Conductive Inks -Enabling Next Generation Flexible & 3D Electronics

Safi-Tech -Supercooled Fully Metallic FHE Interconnect Technology

Agfa/Nanogate - Printed Electronics made with Digital Printing: Materials and Application in Motor Sport

VSParticle - Accelerating the development of new value added materials

NovaCentrix - PulseForge Soldering – Using flash lamp technology for conventional solder alloy reflow

C3Nano - Platform Optoelectronic Materials: Flexible, Rollable, Large-Area, Biotech & Beyond

DuPont Teijin Films/Fraunhofer FEP - Advances in Polyester Film Substrates for Flexible Electronics

Panasonic - Development of Stretchable, Conformable and Pliable Circuit Materials

Metamaterial Inc (META) - The Dawn of Electro-Optics: Emerging Multi-functional and High-Performance Metamaterials

Procter & Gamble/Coca-Cola - Panel Discussion - Smart & Intelligent Packaging

Wed, 12 May

TechBlick - Welcome & Introdution

Wuerth - Challenges & Opportunities of AM in Passive Electronic Industry – A Practical Approach on Materials, Designs an

Signify - Hybrid manufacturing of 3D integrated electronics for LED lighting

VTT - Roadmap Towards More Environmentally Friendly Electronics

Prismade - Secure, invisible and green printed electronics. A journey from ID cards to gamification and to blockchain it

Networking Break

Kimoto - Application of Flexible Light Diffusion Films in User Interfaces

PolyIC - Smart HMI surfaces with inmolded touch sensors and decoration

Kundisch - Applications using Printed and Hybrid Electronics in the HMI Industry

Sheldahl - The Evolution or Revolution of the Human Machine Interface Market

e2ip/ Nat Research Council of Canada- Molecular Ink applied to Printed & In-Mold Electronics

Networking Break

Danish Technology Institute /ACCIONA - LEE-BED: Services and infrastructure within printed and embedded electronics

Brewer Science - Printed Smart Devices: Enabling Widespread, Real-Time Sensing

Applied Materials - Advanced screen printing for PE: two case studies of industrial applications in medical and display

Hewlett Packard - HP’s 3D Printing of Electronics using Multi Jet Fusion

IDS - NanoJet: The Next Generation in Aerosol Printing

NanoOps -High-Throughput Wafer Printing of Nano and Microelectronics: A Fab in A Tool

Airbus/Boeing - Panel Discussion - Opportunities & Challenges for Printed Hybrid Electronics in Aerospace